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Analytical Study and Experimental Verification of Shear-Thinning Ink Flow in Direct Ink Writing Process
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Zipeng Guo, Fan Fei, Xuan Song, Chi Zhou
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145 |
7 |
071001–None |
2023 |
32.47 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Multiclass Reinforced Active Learning for Droplet Pinch-Off Behaviors Identification in Inkjet Printing
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Zebin Li, Luis Javier Segura, Yifu Li, Chi Zhou, Hongyue Sun
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145 |
7 |
071002–None |
2023 |
36.3 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Jerk-Optimal Piecewise Planning of Tool Orientation for 5-Axis Ball-End Machining With Linearized Kinematic Constraints
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Lei Wu, Jinting Xu, Xiaolong Yin, Yuwen Sun
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145 |
7 |
071003–None |
2023 |
23.57 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Implementation of Precision Machine Tool Thermal Error Compensation in Edge-Cloud-Fog Computing Architecture
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Lin Zhang, Chi Ma, Jialan Liu, Hongquan Gui, Shilong Wang
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145 |
7 |
071004–None |
2023 |
39.43 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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A Hybrid Deep Generative Network for Pore Morphology Prediction in Metal Additive Manufacturing
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Zheren Song, Xinming Wang, Yuanyuan Gao, Junbo Son, Jianguo Wu
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145 |
7 |
071005–None |
2023 |
23.55 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond
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Song Yuan, Xiaoguang Guo, Hao Wang, Shang Gao
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145 |
7 |
071006–None |
2023 |
42.35 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Face Turning of Single Crystal (111)Ge: Cutting Mechanics and Surface/Subsurface Characteristics
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A. Zare, M. Tunesi, T. A. Harriman, J. R. Troutman, M. A. Davies, D. A. Lucca
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145 |
7 |
071007–None |
2023 |
40.24 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Simulating the Evolution of Non-Metallic Inclusions During the Forging Process
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Brandon T. Mackey, Thomas Siegmund, Michael D. Sangid
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145 |
7 |
071008–None |
2023 |
34.3 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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On Kinematics in Sequential Three-Dimensional Stretch Bending: Analytical Springback Model
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Taekwang Ha, Torgeir Welo, Geir Ringen, Jyhwen Wang
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145 |
7 |
071009–None |
2023 |
33.47 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Understanding the Effects of Process Conditions on Thermal–Defect Relationship: A Transfer Machine Learning Approach
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Ayantha Senanayaka, Wenmeng Tian, T. C. Falls, Linkan Bian
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145 |
7 |
071010–None |
2023 |
43.47 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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