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Journal of Materials Science - 巻 58 / 号 26

タイトル
著者 巻 号 ページ 年 PKV
Lowering thermal conductivity in thermoelectric Ti2−xNiCoSnSb half Heusler high entropy alloys
Soumya Ranjan Mishra, Anirudha Karati, B. S. Murty 58 26 10736–10752 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Thermomigration-induced failure in ball grid array solder joint under high current stressing
Peng Liu, Sen Cong, Ping Wu 58 26 10753–10763 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
In situ EBSD study of formation and propagation of deformation bands in a single-crystal superalloy during tensile deformation
Feiqi Li, Wenxiang Jiang, Ze Zhang 58 26 10764–10781 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Effect of grain size and second phase on the corrosion behavior of MIG-welded Al–Mg–Si–Mn–Cr alloy
Kaige Tang, Lili Wei, Shuhui Liu 58 26 10782–10801 2023 1.0
平均評価: 0.0 / 5 (0 件のレビュー)
Temporal evolution of microstructure and its influence on micromechanical and tribological properties of Stellite-6 cladding under aging treatment
Jiankun Xiong, Yang Guo, Xia Li 58 26 10802–10820 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Thiol-ene clickable gelatin–hyaluronic acid cryogels
Gulshakhar Kudaibergen, Zhanar Akhmetkarimova, Murat Baidarbekov 58 26 10821–10831 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Validation and improvement in metallic material tensile models for small punch tests
Qiwen Li, Xun Wang, Yongdian Han 58 26 10832–10852 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Synergistic effect of graphene oxide and cathodic protection to enhance the long-term protective performance of organic coatings
Tianxiang Sun, Kai Jin, Shougang Chen 58 26 10853–10869 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding
Jiaxin Liu, Weishan Lv, Mingxiang Chen 58 26 10870–10884 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Effect of vanadium element on the continuous precipitation behavior of Cu–3.2Ti–0.2Fe alloys
Weijiang Liu, Xinhe Gao, Bin Yang 58 26 10885–10895 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)