18981
Letter to the Editor
John Campbell
Metallurgical and Materials Transactions A
47
8
3803–3805
2016
1.0
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18982
Grain Refinement of a Large-Scale Al Alloy Casting by Introducing the Multiple Ultrasonic Generators During Solidification
Ruiqing Li, Zhilin Liu, Pinghu Chen
Metallurgical and Materials Transactions A
47
8
3790–3796
2016
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18983
A Bayesian Approach for One-Shot Device Testing With Exponential Lifetimes Under Competing Risks
Narayanaswamy Balakrishnan, Hon Yiu So, Man Ho Ling
IEEE Transactions on Reliability
65
1
469–485
2016
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18984
Joint Particle Filters Prognostics for Proton Exchange Membrane Fuel Cell Power Prediction at Constant Current Solicitation
Marine Jouin, Rafael Gouriveau, Daniel Hissel, Marie-Cécile Péra, Noureddine Zerhouni
IEEE Transactions on Reliability
65
1
336–349
2016
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18985
A New Degradation Indicator Based on a Statistical Anomaly Approach
João Paulo Pordeus Gomes, Roberto Kawakami Harrop Galvão, Takashi Yoneyama, Bruno P. Leão
IEEE Transactions on Reliability
65
1
326–335
2016
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18986
Intelligent Condition Based Monitoring Using Acoustic Signals for Air Compressors
Nishchal K. Verma, Rahul Kumar Sevakula, Sonal Dixit, Al Salour
IEEE Transactions on Reliability
65
1
291–309
2016
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18987
A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability
Rossella Berni, Marcantonio Catelani, Caterina Fiesoli, Valeria L. Scarano
IEEE Transactions on Reliability
65
1
272–281
2016
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18988
A Spatio-Temporal Defect Process Model for Competing Progressive Breakdown Modes of Ultra-Thin Gate Oxides
Seong-Joon Kim, Tao Yuan, Suk Joo Bae
IEEE Transactions on Reliability
65
1
263–271
2016
1.0
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18989
Optical Degradation Mechanisms of Indium Gallium Nitride-Based White Light Emitting Diodes by High-Temperature Aging Tests
Yi-Jun Lu, Zi-Quan Guo, Tien-Mo Shih, Yu-Lin Gao, Wei-Lin Huang, Hong-Li Lu, Yue Lin, Zhong Chen
IEEE Transactions on Reliability
65
1
256–262
2016
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18990
A Novel Layout-Based Single Event Transient Injection Approach to Evaluate the Soft Error Rate of Large Combinational Circuits in Complimentary Metal-Oxide-Semiconductor Bulk Technology
Yankang Du, Shuming Chen
IEEE Transactions on Reliability
65
1
248–255
2016
1.0
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