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アクセスランキング(PKV)

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順位 タイトル
著者 雑誌 ページ PKVアクセス数
26261 Cement slurry penetration behavior of swirl grouting technology
Tao Lu, Yong Li Physics of Fluids 36 9 095129–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26262 Simulation of a coarse solid sphere settling in a riser with transverse vibrations
Mingzhu Wei, Jinlong Duan, Xu Wang, Jifu Zhou Physics of Fluids 36 3 033325–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26263 Investigation on gas–liquid–solid three-phase flow characteristics in aircraft wastewater pipes
Helei Zhang, Xiande Fang, Yuying Zhang, Huixiang Wu Physics of Fluids 36 3 033350–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26264 Falling liquid film down a non-uniformly heated slippery inclined plane with odd viscosity effects
Souradip Chattopadhyay International Journal of Heat and Mass Transfer 218 None 124807–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26265 Vertical water entry of a cylinder considering wind and linearly sheared flow effect: A numerical investigation
Hong-Tao Yuan, Jia-Yu Sun, Shi-Li Sun, Zhao-Fei Zhang, Hui-Long Ren Physics of Fluids 36 3 032114–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26266 Non-equilibrium overlapping grid method with two-phase porous media model for printed circuit heat exchanger based steam generator
Zicheng Tang, Song He, Nianqi Li, Min Zeng, Ting Ma International Journal of Heat and Mass Transfer 232 None 125960–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26267 Machine learning-based design optimization of aperiodic multilayer coatings for enhanced solar reflection
Krutarth Khot, Prabudhya Roy Chowdhury, Xiulin Ruan International Journal of Heat and Mass Transfer 224 None 125303–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26268 Gas–liquid twin-fluid atomization from non-circular orifices
Chang Liu, Kun Wu, Peng Zhang, Xuejun Fan Physics of Fluids 36 3 033331–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26269 Numerical study of mean and turbulent flow adjustments in open channels with limited near-bank vegetation patches
Lei Wang, Shaoxuan Kang, Yaojun Li, Weisheng Chen Physics of Fluids 36 9 095118–None 2024 1.0
平均評価: / 5 ( 件のレビュー)
26270 In situ monitoring of flip chip package process using thermal resistance network method and active thermography
Bin Zhou, Jianxin Qiao, Yunkang Su, Wentao Huang, Longqiu Li International Journal of Heat and Mass Transfer 225 None 125402–None 2024 1.0
平均評価: / 5 ( 件のレビュー)