Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing
['Shujuan Li', 'Aofei Tang', 'Yong Liu', 'Jiabin Wang', 'Dan Cui', 'Robert G. Landers']
/
Journal of Manufacturing Science and Engineering
/ Vol. 139
/ No. 4
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