Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2)
['Satya R. T. Peddada', 'Lawrence E. Zeidner', 'Horea T. Ilies', 'Kai A. James', 'James T. Allison']
/
Journal of Mechanical Design
/ Vol. 144
/ No. 12
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