Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure
['Xiufeng Gao', 'Shaoping Chen', 'Zuhair A. Munir']
/
Journal of Materials Science
/ Vol. 52
/ No. 6
0.0 / 5
0
Reviews
You must log in to post, edit and delete a review.
Log in
Earn 50 points when your review is published.
About KnowledgeRank Points
No reviews have been posted yet. Be the first to write one!