Interfacial structures between aluminum nitride and Cu–P–Sn–Ni brazing alloy with Ti film
['Nobuyuki Terasaki', 'Naochika Kon', 'Kevin M. Knowles']
/
Journal of Materials Science
/ Vol. 56
/ No. 14
0.0 / 5
0
Reviews
You must log in to post, edit and delete a review.
Log in
Earn 50 points when your review is published.
About KnowledgeRank Points
No reviews have been posted yet. Be the first to write one!