Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera
['Toshiki HIROGAKI', 'Eiichi AOYAMA', 'Keiji OGAWA', 'Suguru ONCHI', 'Munetaka I ...']
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Transactions of the JSME (in Japanese)
/ Vol. 82
/ No. 836
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