Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)
['Jumpei KUSUYAMA', 'Ayumu HONDA', 'Shintaro IWAHASHI', 'Takayuki KITAJIMA', 'Ak ...']
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Transactions of the JSME (in Japanese)
/ Vol. 83
/ No. 852
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