Development of an Ag-Free Sn–Ti–Ni Solder for Low-Temperature Ultrasonic-Assisted Flux-Free Joining of Aluminium Alloys in Air
['Liam Hardwick', 'Mirtunjay Kumar', 'Yong Xiao', 'Russell Goodall']
/
Metallurgical and Materials Transactions A
/ Vol. 57
/ No. 11
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