Erratum to “Enhanced thermal management for vertically immersed high-power chips via micro-pillar structured surfaces” [Int. J. Heat Mass Transf. 271 P2 (2026) 129401]
['Yuhao Yan', 'Ying Liu', 'Longhuang Xiao', 'Jialiang Yang', 'Yongjie Lu', 'Gongran Ye', 'Yingjie Xu', 'Xiaohong Han']
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International Journal of Heat and Mass Transfer
/ Vol. 271
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