Flat-punch contact modeling and slurry-specific removal behavior of micro-patterned pads in SiO₂ chemical mechanical planarization (CMP)
['Geumji Back', 'Shinil Oh', 'Seungjun Oh', 'Wonbin Ko', 'Changshou Jin', 'Donghwan Choi', 'Hyunwoo Shim', 'Jinhyoung Lee', 'Dongho Lee', 'Seowoo Son', 'Taesung Kim']
/
Tribology International
/ Vol. 227
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