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Origami theory-inspired multiscale simulation of folded graphene aerogel with improved mechanical properties
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Tao Wang, Haiming Li, Wei Ding
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59 |
18 |
7825–7839 |
2024 |
3.0 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Investigation of group 13 elements as potential candidates for p-type dopants in the narrow-gap thermoelectric semiconductor α-SrSi2
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Haruno Kunioka, Daishi Shiojiri, Tsutomu Iida
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59 |
18 |
7840–7853 |
2024 |
2.0 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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In vitro corrosion behavior of biodegradable WE43 alloy under various physiological flow velocities
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Jianwei Dai, Xiangang Zhang, Chenglin Chu
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59 |
18 |
7854–7872 |
2024 |
3.0 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Hydrogen trapping and embrittlement of titanium- and vanadium carbide-containing steels after high-temperature hydrogen charging
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Tim Boot, Athira Suresh Kumar, Vera Popovich
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59 |
18 |
7873–7892 |
2024 |
3.0 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Uncovering the effect of Mo addition on the precipitation kinetics of the γ′ phase in Ni–Al–Mo model superalloys using CALPHAD-assisted phase-field simulations
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Zexin Wang, Chuanxin Liang, Xiangdong Ding
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59 |
18 |
7893–7912 |
2024 |
0.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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Enhanced oxidation resistance and adhesion performance of Cr–Mo-coated Zry-4 by a thin Cr layer in steam up to 1600 °C
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Chaowen Zhu, Yu Sun, Xiaochun Han
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59 |
18 |
7913–7930 |
2024 |
3.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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Effect of NdCl3 on characteristics of micro-arc oxidation coating formed on TC4 alloy
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Shaolan Yang, Yanfei Duan, Youping Zheng
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59 |
18 |
7931–7944 |
2024 |
0.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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Designing an ultrahigh-strength and ductile Ni-based alloy with a partially recrystallized structure
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Xianghui Zheng, Haoran Lu, Chongxiang Huang
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59 |
18 |
7945–7959 |
2024 |
0.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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Investigation of hot deformation behavior of forged 42CrMoA steel by cellular automata method based on topological deformation technique
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Xingwang Duan, Yingqing Chen, Jiachen Liu
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59 |
18 |
7960–7983 |
2024 |
3.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints
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H. Wei, Z. J. Zhang, W. R. Liang
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59 |
18 |
7984–7997 |
2024 |
0.0 |
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Average Rating: 0.0 / 5
(0 Reviews)
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