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First-principles investigation of Bi2S3 as sensitive and selective NO2 sensor upon humidity exposure
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Qinkai Feng, Xiuhuai Xie, Ningbo Liao
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58 |
5 |
2198–2208 |
2023 |
4.88 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Highly thermally conductive and flexible reduced graphene oxide films produced using two-step liquid-phase repairing method with hydriodic acid
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Jing Li, Jinshui Liu, Yuxun Chen
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58 |
5 |
2209–2221 |
2023 |
5.86 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Enhanced ionic conductivity of Na-excess Na3Zr2Si2PO12 solid electrolyte by tuning its elemental composition and sintering temperature
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Y. Bhaskara Rao, K. Ramakrushna Achary, L. N. Patro
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58 |
5 |
2222–2233 |
2023 |
4.88 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Bismuth-based compounds as efficient sulfur hosts for novel lithium-sulfur batteries
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Zhanlong Li, Kun Hu, Jinyi Lian
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58 |
5 |
2234–2248 |
2023 |
3.9 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Efficient encapsulation of isocyanates in PCL/PLA biodegradable microcapsules for adhesives
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António Aguiar, Mónica V. Loureiro, Ana C. Marques
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58 |
5 |
2249–2267 |
2023 |
6.79 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Additive manufacturing of anti-bacterial and low-cost Ti–Mo(–Ag) alloys using elemental powders through in situ laser alloying
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J. Y. Xu, K. L. Li, M. Yan
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58 |
5 |
2268–2293 |
2023 |
4.9 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Effect of arc current on the microstructure, tribological and corrosion performances of AISI 420 martensitic stainless steel treated by arc discharge plasma nitriding
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Jie Li, Xiao Tao, Shihong Zhang
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58 |
5 |
2294–2309 |
2023 |
4.88 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Precipitate evolution and thermal stability of A205 fabricated using laser powder bed fusion
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Anup Kulkarni, Dheepa Srinivasan, Vikram Jayaram
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58 |
5 |
2310–2333 |
2023 |
3.9 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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Investigation of Al-induced electroless cobalt–tin alloy deposition on Cu substrate
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Siddhartha Mukherjee, Swatilekha Ghosh
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58 |
5 |
2334–2346 |
2023 |
5.88 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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The effect of solvents on thermal stability of solder pastes in reflow process
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Jiajun Wang, Jubo Peng, Xiaojing Wang
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58 |
5 |
2347–2359 |
2023 |
2.96 |
|
Average Rating: 0.0 / 5
(0 Reviews)
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