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Fatigue & Fracture of Engineering Materials & Structures - 巻 45 / 号 1

タイトル
著者 ページ PKV
An improved fatigue life model for mechanical components considering load strengthening characteristics
Jiazhi Liu, Xintian Liu, Minghui Zhang, Shuci Wang 45 1 174–185 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Characterization of isothermal and cyclic thermal damage of EB-PVD TBCs with the help of the 3D-DIC technique
Shun Yang, Huang Yuan 45 1 186–202 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Deformation and fracture behavior of strong–weak coupling structure and its application in coal roadway instability prevention
Yangfeng Zheng, Cheng Zhai, Jianguo Zhang, Xu Yu, Jizhao Xu, Yong Sun, Yuzhou Cong, Wei Tang 45 1 203–221 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Application of a semianalytical strain assessment and multiaxial fatigue analysis to compare rolling contact fatigue in twin-disk and full-scale wheel/rail contact conditions
Nicola Zani, Magnus Ekh, Anders Ekberg, Angelo Mazzù 45 1 222–238 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Fatigue behavior after pre-corroded in a simulated body fluid for ZK60 magnesium alloy prepared by micro-arc oxidation
Ying Xiong, Yi Yu, Jie Yang 45 1 239–258 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
The life evaluation by linear cumulative damage rule for cold dwell fatigue of Ti-6Al-4V alloy
Yutaro Ota, Keiji Kubushiro, Yasuhiro Yamazaki 45 1 259–269 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Crack evolution law and failure mode of red sandstone under fatigue–creep interaction
Ju Wang, Jiangteng Li, Zhanming Shi 45 1 270–284 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Insight into the fracture evolution behavior of pre-flawed hollow-cylinder granite under multi-stage increasing-amplitude cyclic loads: A lab-scale testing
Yu Wang, Haonan Yang, Jianqiang Han, Chun Zhu 45 1 285–301 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Creep damage behaviors of red sandstone subjected to uniaxial compression after high-temperature heat treatment using acoustic emission technology
Xiaokang Pan, Filippo Berto, Xiaoping Zhou 45 1 302–322 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Fatigue life of solder joints in nanosilver tin paste in chip interconnect
Hui Yang 45 1 323–327 2022 0.0
平均評価: 0.0 / 5 (0 件のレビュー)