Application of Embedded Stress Sensors for Third-Generation Reliability of Electronic Systems: Validation and Calibration of Mechanical Models in Fan-Out Wafer-Level Packaging
['Yuexing Wang', 'Linwei Cao', 'Xu He', 'Kun Liu', 'Shuairong Deng', 'Quanfeng Zhou', 'Xiangyu Sun', 'Yao Yao']
/
IEEE Transactions on Reliability
/ Vol. 74
/ No. 4