Integrated Temperature and Stress Sensors in Fan-Out Wafer-Level Packaging to Better Achieve the Third-Generation Reliability of Electronic Systems
['Linwei Cao', 'Yuexing Wang', 'Kun Liu', 'Xiangou Zhang', 'Shuairong Deng', 'Quanfeng Zhou', 'Xiangyu Sun', 'Wanli Zhang']
/
IEEE Transactions on Reliability
/ Vol. 74
/ No. 3