Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
['Bin Lin', 'Ping Zhou', 'Ziguang Wang', 'Ying Yan', 'Renke Kang', 'Dongming Guo']
/
Journal of Manufacturing Science and Engineering
/ Vol. 140
/ No. 12
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