Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiCf/SiC Composites
['Zhigang Dong', 'Haitao Zhang', 'Yan Bao', 'Feng Yang', 'Zhongwang Wang', 'Renke Kang']
/
Journal of Manufacturing Science and Engineering
/ Vol. 145
/ No. 5
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