Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
['Takuya Kadoguchi', 'Naoya Take', 'Katsuaki Suganuma']
/
Journal of Materials Science
/ Vol. 52
/ No. 6
0.0 / 5
0
Reviews
You must log in to post, edit and delete a review.
Log in
Earn 50 points when your review is published.
About KnowledgeRank Points
No reviews have been posted yet. Be the first to write one!