Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales
['Jie Chen', 'Mark A. Tschopp', 'Avinash M. Dongare']
/
Journal of Materials Science
/ Vol. 53
/ No. 8
0.0 / 5
0
Reviews
You must log in to post, edit and delete a review.
Log in
Earn 50 points when your review is published.
About KnowledgeRank Points
No reviews have been posted yet. Be the first to write one!