A thermomechanical constitutive model for investigating the fatigue behavior of Sn-rich solder under thermal cycle loading
['Zhao Zhang', 'Sheng Liu', 'Kun Ma', 'Tielin Shi', 'Zhengfang Qian', 'Kang Liang', 'Fang Dong']
/
Fatigue & Fracture of Engineering Materials & Structures
/ Vol. 45
/ No. 7
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