Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders
['Kathlene N. Reeve', 'Stephanie M. Choquette', 'Carol A. Handwerker']
/
Metallurgical and Materials Transactions A
/ Vol. 47
/ No. 12
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