A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves
['H. Y. Zhao', 'J. H. Liu', 'J. C. Feng']
/
Metallurgical and Materials Transactions A
/ Vol. 49
/ No. 7
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