Development of a Numerical Model for Simulating Transient Liquid Phase (TLP) Bonding Involving Two Solid–Liquid Interfaces that Concurrently Undergo 2D or 3D Migration
['Oluwadara C. Afolabi', 'Olanrewaju A. Ojo']
/
Metallurgical and Materials Transactions A
/ Vol. 52
/ No. 6
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