Fatigue behaviour analysis of thermal cyclic loading for through-silicon via structures based on backstress stored energy density
['Hongjiang Qian', 'Zhiyong Huang', 'Haidong Fan', 'Yuexing Wang', 'Chaoquan Zhao']
/
International Journal of Fatigue
/ Vol. 178
まだレビューは投稿されていません。あなたが最初のレビューを書きませんか？