Grain refinement and IMCs suppression via 3D porous copper mesh for enhanced Mg/Al interfacial strength
['WenYu Du', 'ZhiHao Yi', 'XinDong Wang', 'Hao Tian', 'XiaoLong Shi', 'QiLin Den', 'Ting Yuan', 'HongJun Hu']
/
Journal of Materials Science
/ Vol. 61
/ No. 39
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