Powered by Engineering Brain, Japan | PKVとは | PKV Methodology | KnowledgeRank v4.0.0: PKV Trends of My Authored Papers Are Now Available on My Page

International Journal of Solids and Structures - 巻 279 / 号 None

タイトル
著者 ページ PKV
Dynamic peeling process of IC chip from substrate based on a 3D analytical model
Jinping Fu, Wei Du, Huiming Hou, Xiaohua Zhao, Tao Wu 279 None 112374–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Multi-point scattering measurements for effective property extraction from metamaterials with skin effects
Joshua Morris, Alireza V. Amirkhizi 279 None 112372–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Impact response of negative stiffness curved-beam-architected metastructures
Navid Mehreganian, Arash S. Fallah, Pooya Sareh 279 None 112389–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
A novel reinforced cylindrical negative stiffness metamaterial for shock isolation: Analysis and application
Yi Pan, Yang Zhou, Meng Wang, Qiang Gao, Beibei Sun 279 None 112391–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
A two-scale framework for coupled mechanics-diffusion-reaction processes
Michael Poluektov, Łukasz Figiel 279 None 112386–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)
Indentation of geometrically exact adhesive beams
Krishnan Suryanarayanan, Thiruvelu Bhuvana, Ishan Sharma, Sovan Lal Das 279 None 112348–None 2023 0.0
平均評価: 0.0 / 5 (0 件のレビュー)